Automatically converts selected pads into SMT parts by calculations based on the centroid of the SMT FootPrints.

Allows the user to manually teach through hole and custom shaped SMT patterns.

Performs character recognition on silkscreen data in order to automatically assign reference designators to parts.

Allows the user to import, merge and package part numbers from a Bill of Materials (BOM) and other information into a parts layer by matching the BOM's part numbers and reference designators with parts layer reference designators.

A detailed analysis of the parts contained on a board can be obtained using the Assembly Analysis report. The report is saved externally for easy distribution to interested parties and contains user-defined information. Information that can be included in the report ranges from simple information such as total number of parts to more specific information based on an individual Package Style. Additional sections include information on off-angle parts, information based on Part Number, estimated Solderpaste volume, and duplicate reference designators.

Many part properties can be assigned to part numbers or specific part instances, including Alternate Part Number, Feeder, and part values.

Provides users with several efficient stencil editing solutions, including pad splitting, "C" pad creation, heel and toe edits, and automatic pad adjustment for pad-pitch manipulation. 

• Amistar • Permatek • Siemens • Dynapert • Philips • TDK • Europlacer • Quad Systems • Universal • Fuji • Sanyo • KME • Juki • Mydata • Panasonic